IBM launches Single-Chip Mobile Solutions

IBM today announced the introduction of a new semiconductor technology designed for mobile handset and wireless technology markets.This new offering will enable chipset providers for mobile devices to further reduce the complexity of their components -- representing a significant savings in manufacturing costs for the next generation of mobile phones, laptops and other portable communication devices.This new semiconductor technology -- named CMOS 7RF SOI -- is designed to enable single-chip Radio Frequency (RF) solutions by integrating the multiple RF/analog functions of today's handsets -- such as multi-mode/multi-band RF switches, complex switch biasing networks, and power controllers -- into single-chip solutions for mobile devices.Single-chip solutions address the need for fully integrated multimedia functionality on low-cost handsets, providing entry-level users in emerging markets such as China, India and Latin America with affordable, power-efficient and high-performance mobile devices.The 180-nm CMOS 7RF SOI is tailored for RF switch applications that provide a low-cost alternative to solutions based on gallium arsenide (GaAs). The breakthrough technology in SOI can minimize insertion loss and maximize isolation to help avoid issues such as loss of signal or dropped calls, potentially enabling significant cost advantages to mobile handsets.